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SKHynix had lots and lots of memory goodies at IDF including some vertical/3D NAND flash, LPDDR3, and HBM modules. This material is proprietary of SK hynix Inc. and subject to change without TSV is a revolutionary technology for overcoming the bottleneck. On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D.

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Latest posts by Charlie Demerjian see all. Once Android makes the bit leap this will matter a lot.

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As head writer of SemiAccurate. To this date, more than patent families relating to TSV stacked memory technology have been published. A focus is also provided on key challenges for TSV stacked memory technology error repair, multi-channel package, thermal dissipation, alignment accuracy, connection failure and solutions found in patents rsv by key players.

In the semiconductor industry, 3D integration using through-silicon via TSV has been considered to be a promising way for improving performance and density instead of conventional device scaling.

GB 3DS LRDIMM < SK hynix

Mount this on to your phone or tsg SoC and off you go, no other memory needed in the system. The deep analysis of the patent portfolios held by key players includes a point on relevant technologies for future developments of TSV stacked memories. Instead of putting transistors on a flat plane with wiring in the third dimension, Hynix, like Samsung, hynid stacking the cells vertically. The report provides a ranking and analysis of the relative strength of the top patent holders derived from their portfolio size, countries of patents filings, current legal status of patents, segmentation of their IP portfolio.


It is pretty mind bending stuff. Sorry, your blog cannot share posts by email.

All main applicants in TSV stacked memory technologies are microelectronics giants. Did you know that you can access all our past subscription-only articles with a simple Student Membership for USD per year? Sep 23, by Charlie Demerjian. Both companies have settled on 24 cells deep, exactly the break point that AMAT said would be economically feasible to make the switch.

Username or Email Address. The patent landscape for TSV stacked memory analyzed ysv this report is quite closed with microelectronics giants and dominated by American and Asian patent applicants.

Could it get better? Charlie Demerjian Roving engine of chaos and snide remarks at SemiAccurate. The following two tabs change content below. The top right box is the interesting one, labeled Ci-MCP.

Have you signed up for our newsletter yet? Most of them are American or Asian.

He is a technologist and analyst specializing in semiconductors, system and network architecture. Main challenges for the future remain the quest for higher bandwidth and density integration. HBM3 with higher capacity and higher bandwidth and low cost HBM with significant cost savings arrive from the narrower width allowing for simpler memory stacks with less TSVs. We observed a decrease of patent applications the last two years, while the first products appeared on the market.


Charlie is also a council member with Gerson Lehman Group. Mobile formats by the 1. First patents involving TSV stacked memories were already published in the s, but the development of the technology really started in the mids with a significant increase of patent publications since then.

S A Have you signed up for our newsletter yet? The memory market has been impacted by the increased difficultly in producing at more compact geometries. Like what you may wonder? The USA and Korea represent the main countries of patent filings, while Europe seems to represent only few interest for patent applicants. ForSamsung predicts on two future paths: This database allows multi-criteria searches and includes patent publication number, hyperlinks to the original documents, priority date, title, abstract, patent assignees and legal status for each member of the patent family.

Further this leads to the reduction of power consumption as well as parasitic resistance and capacitance. If you want both bleeding edge tech and a company that actually will talk to journalists, Hynix was the place to be. That said it is the future of memory so make sure you are familiar with this little grey blob, you will be seeing lots of them in the near future.

This report provides a complete and deep understanding of IP litigation history including litigated patents families and inter-partes reviews.